AMD Patent Reveals Innovative Chip Stacking Method for Scalability

AMD has filed a patent for a new "multi-chip stacking" method that could revolutionize the design and performance of its future Ryzen processors. This innovative approach aims to improve die usage and scalability significantly. The patent describes a "novel packaging design" where smaller chiplets are partially overlapped with a larger die. This technique allows for more chiplets within the same package, maximizing the contact area and enabling higher core counts, larger caches, and increased memory bandwidth. This overlapping approach also has the potential to reduce interconnect latency by shortening the distance between components. Furthermore, it improves power gating efficiency by allowing for better control of individual chiplets. AMD has been a pioneer in multi-chiplet designs for both CPUs and GPUs. This new patent reinforces their commitment to this approach, moving away from monolithic designs towards more modular and scalable solutions. With increasing compe…