Apple's upcoming M5 chip will reportedly use TSMC's 3nm System-on-Integrated-Chip (SoIC) technology, bypassing the more expensive 2nm process for now. This decision is likely cost-driven, with Apple reserving 2nm for future M and A series chips in iPhones, iPads, and Macs.
According to a report from The Elec, Apple has already placed orders for the M5 chip with TSMC for use in future iPad Pro and Mac devices. Mass production is expected to begin in the second half of 2025.
While sticking with 3nm, the M5 will leverage TSMC's advanced SoIC packaging technology. This 3D chip-stacking method offers improved thermal management and reduced electrical leakage compared to traditional 2D designs. Small-scale trial production reportedly started in July.
The M5 is expected to deliver significant performance and efficiency gains. The first devices to feature the M5 could be MacBook Pro models in late 2025 or early 2026, followed by the MacBook Air and iPad Pro in the spring of 2026. However, Apple's plans could change.
Apple also intends to utilize the M5 in its AI server infrastructure to power "Apple Intelligence" features, including a rumored large language model (LLM) for Siri, expected in the spring of 2026.
