ASUS Officially Confirms the Launch of X870 BTF Motherboards at CES 2025 for AMD Ryzen Processors
ASUS has confirmed the launch of X870 BTF (Back to the Future) motherboards alongside Ryzen 9 9000X3D processors at CES 2025.
ASUS has confirmed its plans to launch X870 BTF (Back to the Future) motherboards, designed for AMD Ryzen CPUs, at CES 2025. These connector-less motherboards will debut alongside the new Ryzen 9 9000X3D processors. The announcement came from the General Manager of ASUS China via Bilibili: Everyone knows that the recent 9800X3D is really the strongest on earth. There may be a more powerful CPU at CES later. By then, you will see the new X870 back-plug motherboard. BTF motherboards place almost all connectors on the back, requiring compatible PC cases with special cutouts. While such cases were rare, options like the Thermaltake Tower 600, GameMax F36, and GameMax F46 now support this design. The release of ASUS X870 BTF motherboards could prompt competitors like Gigabyte (Stealth) and MSI (Project Zero) to introduce similar products.