Researchers from the University of Texas at Austin and Sichuan University have developed a new thermal material that could significantly improve cooling in data centers and other high-performance electronics. It's estimated that this material could reduce cooling needs by 13%.
The new thermal interface material (TIM), based on liquid metal and aluminum nitride, offers high thermal conductivity, efficiently transferring heat away from electronic components to a heatsink or liquid cooling system. This reduces the need for traditional cooling systems.
In lab tests, the TIM, when paired with a cooling pump, reduced energy consumption by 65%. This demonstrates the material's significant heat transfer potential. The researchers plan to collaborate with data center providers to test the material in larger systems and broader scenarios.
Analysts predict that data center energy consumption will double by 2028 compared to 2023, largely driven by the increasing demands of AI models. This poses a significant challenge that researchers are actively working to address. This new TIM could be a vital part of the solution.
