SK Hynix Achieves Technological Lead in NAND Flash with 321-Layer Chip
SK Hynix has developed the world's first 321-layer NAND flash chip, surpassing Samsung in cell stacking technology and potentially disruptingthe markt
SK Hynix has reportedly taken the technological lead in the NAND flash market with the development of the world's first 321-layer NAND flash chip. This achievement marks a significant milestone for the company, potentially challenging Samsung's long-held dominance in the segment. The new 321-layer NAND chip promises substantial performance improvements, including 12% faster data transfer speeds, 13% better read performance, and over 10% higher power efficiency. This puts SK Hynix's technology at the forefront of NAND flash innovation. The company claims a 35% increase in layer count compared to its previous generation technology. This development has reportedly shaken Samsung, long considered the pioneer in cell stacking technology. As BusinessKorea noted: If Samsung Electronics allows SK Hynix to catch up in NAND flash following DRAM and HBM, it will be a triple blow, and the symbolism for the industry will be significant...Although Samsung Electronics’ sales share is curren…