Apple's upcoming M5 Pro, M5 Max, and M5 Ultra chips will reportedly adopt a new approach by separating the CPU and GPU onto different dies. This change, enabled by TSMC's advanced SoIC-MH packaging process, is expected to enhance thermal performance, boost overall speed, and improve production yields.
TSMC's SoIC-MH Technology
According to analyst Ming-Chi Kuo, Apple will utilize TSMC's advanced chip packaging technology called SoIC-MH (System-on-Integrated-Chips-Molding-Horizontal). This 2.5D packaging method will allow Apple to integrate the CPU and GPU separately, optimizing thermal management and performance.
Traditionally, Apple's M series chips have been designed as a System-on-a-chip (SoC), integrating all components in a single package. While this has been beneficial in terms of space-saving and efficiency, Apple is now shifting this approach to improve performance even further.
Key Benefits of Separation
- Improved Thermal Performance: Separating the CPU and GPU allows for better heat dissipation, enabling the chip to run at full capacity for longer without thermal throttling.
- Enhanced Performance: This new design approach is expected to lead to significant improvements in both computational and graphical performance.
- Better Production Yields: The SoIC-MH technology is expected to increase production yields with fewer chips failing to meet Apple’s standards.
M5 Chip Timeline and N3P Node
The M5 series chips will also utilize TSMC’s advanced N3P node. The expected production timelines are:
- M5: 1H 2025
- M5 Pro/Max: 2H 2025
- M5 Ultra: 2026
While there have been rumors about similar changes for the A-series chips for the iPhone, it seems unlikely that Apple will implement this approach immediately. However, the move suggests that future Apple chips may well incorporate similar design principles.
This new architecture is also slated to power Apple’s servers, enhancing the performance of Apple Intelligence for cloud-based services.
It remains to be seen if Apple will eventually separate the CPU and GPU on its A series chips. For the time being the company seems to be starting small with improvements to Ram.
