Apple M5 Chips to Separate CPU and GPU for Improved Performance

Apple's upcoming M5 Pro, M5 Max, and M5 Ultra chips will reportedly adopt a new approach by separating the CPU and GPU onto different dies. This change, enabled by TSMC's advanced SoIC-MH packaging process, is expected to enhance thermal performance, boost overall speed, and improve production yields. TSMC's SoIC-MH Technology According to analyst Ming-Chi Kuo, Apple will utilize TSMC's advanced chip packaging technology called SoIC-MH (System-on-Integrated-Chips-Molding-Horizontal). This 2.5D packaging method will allow Apple to integrate the CPU and GPU separately, optimizing thermal management and performance. Traditionally, Apple's M series chips have been designed as a System-on-a-chip (SoC), integrating all components in a single package. While this has been beneficial in terms of space-saving and efficiency, Apple is now shifting this approach to improve performance even further. Key Benefits of Separation Improved Thermal Performance: Separating the CPU and…