Broadcom Unveils Cutting-Edge 3.5D XDSiP Technology for AI

Broadcom has announced its groundbreaking 3.5D eXtreme Dimension System in Package (XDSiP) platform technology, designed to significantly boost performance and efficiency in custom compute platforms for AI and high-performance computing (HPC). High-Density Integration for AI at Scale The 3.5D XDSiP integrates over 6000 mm² of silicon and up to 12 high-bandwidth memory (HBM) stacks into a single package. This innovative Face-to-Face (F2F) 3D stacking architecture directly connects the top metal layers of the dies, resulting in superior interconnect density, power efficiency, and reduced latency compared to traditional Face-to-Back (F2B) approaches. This technology is crucial for meeting the immense computational demands of training large language models (LLMs), which require massive clusters of XPUs (custom accelerators). Traditional methods are struggling to keep pace, making advanced SiP integration essential. Key Benefits of 3.5D XDSiP: 7x increase in signal density compared to F2B 10x r…