MediaTek is reportedly working on a new SoC called the Dimensity 9350, designed to compete with Qualcomm's rumored Snapdragon 8s Gen 4. This news comes after the unveiling of MediaTek's flagship Dimensity 9400 chip.
While Qualcomm is expected to release a more affordable version of the Snapdragon 8 Elite, possibly named the Snapdragon 8s Gen 4 or Snapdragon 8s Elite, MediaTek is preparing a less powerful alternative to its Dimensity 9400. According to a leak from Digital Chat Station on Weibo, this chip will be named the Dimensity 9350.
Dimensity 9350 Details
Although specific technical details are yet to be revealed, the Dimensity 9350 is expected to offer most of the flagship features of the Dimensity 9400 at a lower price point. A key difference could lie in the manufacturing process. While the Dimensity 9400 utilizes TSMC's second-generation 3nm process, the Dimensity 9350 may be fabricated on a 4nm 'N4P' process, similar to previous Dimensity chips.
The performance capabilities of the Dimensity 9350 are still unknown, but if it can deliver better overall performance than MediaTek's 2023 flagship SoCs, it could become a popular choice for smartphone manufacturers.
Potential Improvements
One area where MediaTek could improve is the L3 cache. The Dimensity 9400 notably featured a 50% increase in L3 cache compared to the Dimensity 9300, and the Cortex-X925 core doubled the cache of last year’s Cortex-X4. If MediaTek implements a similar increase in cache with the Dimensity 9350, it could see similar performance gains.
As with any unconfirmed information, this should be treated as speculation until more information becomes available.
