Samsung's chances of supplying HBM3E memory to NVIDIA this year appear slim, as the Korean tech giant has reportedly failed to meet NVIDIA's quality standards.
Samsung previously admitted in an investor's note that its HBM3E modules couldn't pass NVIDIA's qualification tests. A recent report from Daily Korea reinforces this, stating that supplying HBM3E to NVIDIA in 2024 is "virtually impossible."
It is realistically impossible for Samsung Electronics to supply 8-layer and 12-layer HBM3E to Nvidia this year...we were unable to meet Nvidia's requirements for chip performance. - Samsung via Daily Korea
This setback gives competitor SK hynix a significant advantage in the HBM market. SK hynix's superior methodologies, such as "MR-MUF," have reportedly set a high bar for performance, making it challenging for Samsung to secure NVIDIA's orders.
While Samsung faces challenges in the HBM and NAND markets, the company is expected to begin HBM3E supply to NVIDIA in Q1 2025. With its own semiconductor and memory production capabilities, Samsung hopes to regain ground with the next-generation HBM4 process, though competition from SK hynix and TSMC remains strong.