Taiwan Semiconductor Manufacturing Co. (TSMC) has revealed plans to bring its 2-nanometer (2nm) chip production technology to its Arizona facilities by 2028, according to Wu Cheng-wen, head of Taiwan's National Science and Technology Council (NSTC).
This timeline adheres to Taiwanese regulations, which mandate a three-year gap between domestic and overseas production of cutting-edge semiconductor technology. TSMC aims to commence full-scale 2nm chip production in Taiwan by 2025, with test production already underway in Hsinchu County.
TSMC's Arizona expansion involves three fabrication plants (fabs). The first fab is scheduled to start producing 4nm chips in early 2025. The second, slated for 2028, will handle 3nm and 2nm chips. A third facility, supported by a tentative $6.6 billion subsidy, will focus on 2nm or more advanced technology, with production targeted for the end of 2030. TSMC recently received final approval for this funding through the CHIPS Incentives Program.
Meanwhile, 2nm production in Taiwan is also gaining momentum. The Baoshan plant in Hsinchu County is expected to reach full production in 2025, followed by another plant in 2026. In Kaohsiung, the first 2nm facility is on track for 2026, with another currently under construction.
Taiwan's Ministry of Economic Affairs is closely monitoring the transfer of advanced technologies overseas, emphasizing that TSMC must establish successful domestic production of its most advanced processes before expanding abroad.
