TSMC's 2nm CyberShuttle Service to Reduce Chip Production Costs

TSMC is set to launch its 2nm "CyberShuttle" service in April 2025, offering a cost-effective solution for clients like Apple to evaluate their chips. This wafer-sharing approach is expected to significantly reduce the high costs associated with 2nm chip production. Addressing the High Cost of 2nm The estimated cost of a single 2nm wafer is around $30,000. TSMC's CyberShuttle service, also known as wafer sharing, aims to mitigate these expenses. By allowing multiple clients to test their chips on the same wafer, TSMC can reduce design and mask costs, while also accelerating the testing process. Benefits of CyberShuttle This innovative approach offers several advantages: Reduced Costs: Lower design and mask costs for clients. Faster Testing: Accelerated test production time. Increased Revenue for TSMC: Allows for faster order placement and a potential revenue surge. TSMC's Production Capacity To meet the anticipated high demand for 2nm chips, TSMC has two fully operational …