Early rumors have surfaced regarding AMD's product plans for 2026, revealing potential details about their next-generation CPUs, GPUs, and APUs. Here’s a breakdown of the speculated technologies and features.
Zen 6 CPU Architecture
According to the rumors, the desktop Zen 6 CPUs will utilize the following:
- CCD (Core Complex Die): Fabricated using the N3E process.
- IOD (Input/Output Die): Fabricated using the N4C process.
UDNA GPU: Flagship Return
The rumors also suggest that AMD's GPU division is preparing a new flagship based on the UDNA architecture, which will also be built using the N3E process. This suggests a high-performance GPU aimed at competing with the top-end offerings of other manufacturers.
Halo X3D APU
The next-generation Halo APU is rumored to incorporate 3D stacking technology to enhance both CPU and GPU performance simultaneously. The specific packaging method is still under discussion, with the simplest approach being a shared method.
Console Implications
Rumors also indicate that Sony is planning to incorporate 3D stacking in their next-generation console, although Microsoft's plans remain unclear at this time.
Disclaimer
It is important to remember that these are just rumors, and the final specifications and implementation may differ. More concrete details are expected closer to the release date.
