TSMC has reportedly commenced a small-scale production run of 5,000 monthly wafers on its 2nm process at its Baoshan plant. The company has also launched an advanced N2P variant of its 2nm technology.
2nm Production and Capacity
TSMC has established two 2nm wafer production bases in Taiwan: Baoshan and Kaohsiung. While reaching maximum capacity will take several years, TSMC aims to meet the demand of major clients like Apple, Qualcomm, and MediaTek. The Baoshan plant is now in a small-scale production phase of 5,000 wafers per month, following a reported 60% yield during trial runs.
Prior reports indicated that TSMC had achieved 10,000 units during its trial production, with a target of 50,000 units later this year. By 2026, production capacity is estimated to reach 80,000 units, though it's unclear if that's for both the N2 and N2P processes or just one.
Advanced N2P Variant
The advanced 2nm 'N2P' node is expected to enter mass production in 2026. This will be the enhanced version of TSMC's first-generation 2nm process.
Wafer Pricing and Cost Reduction
The cost of 2nm wafers is estimated to reach $30,000, which could be a concern for TSMC's clients. However, the company is exploring cost reduction strategies. One initiative is a service called "CyberShuttle," launching in April, which will allow multiple clients to test their chips on the same wafer, reducing individual expenses.
TSMC hopes that increased production volume at both the Baoshan and Kaohsiung plants will help to balance costs through economies of scale. We will continue to monitor TSMC's progress throughout the year.
